Futurum analyst Todd R. Weiss explores the newly-announced Intel MediaTek chip partnership that will drive global production of smart edge device chips by Intel for use by MediaTek’s device-making customers.
Why MediaTek’s New Dimensity 9000 May Not Be a Legitimate Premium Mobile Chipset After All
Futurum senior analyst Olivier Blanchard examines MediaTek’s claim that its new Dimensity 9000 mobile SOC can compete against Qualcomm’s Snapdragon 888 in the premium tier. In addition to outlining some of the key industry hurdles facing MediaTek in its efforts to finally break into the premium tier, Blanchard outlines critical areas in which Dimensity 9000 appears to fall short of delivering premium mobile experiences for OEMs and their customers, namely modem/connectivity, camera/computer vision, AI, and mobile gaming.
Moving on from Huawei, Honor May Find The Perfect 5G Mobile Platform Partner In Qualcomm
In the wake of becoming independent from Huawei last year, the company is now free to work with U.S. chipmakers. While the company reports multiple partnership with key global chipmakers, Futurum’s Olivier Blanchard has his eye on Honor and Qualcomm and the ability of Qualcomm’s mid-range and budget SOCs as early as next year. Why? The Snapdragon platform’s ability to deliver mmWave-ready modems and complete SOCs across a range of price-points is an advantage that may prove difficult for Mediatek to overcome.