Intel CEO Pat Gelsinger has charted a path to expand Intel’s leadership in both semiconductor design and fabrication, including the new RibbonFET transistor architecture, the PowerVia power delivery system, and a revamped node framework that sets the stage for a shift from Nanometer to Angstrom terminology. Our Futurum analysts break it down and explain why this, and the new Intel Foundry Services (IFS), are key to Intel achieving process performance parity by 2024 and leadership by 2025.
